Sawing & Wafers

How multi-wire saws cut silicon ingots into wafers, from loose-abrasive slurry to diamond wire.

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  How multi-wire sawing turns a silicon ingot into wafers

  The working principle of a multi-wire saw: wire web, wire guides, feed, loose versus fixed abrasive, kerf, wafer thickness and the quality criteria of as-cut wafers.

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  The switch to diamond wire: what changed in wafer cutting

  Diamond wire sawing compared with slurry sawing: fixed abrasive, thinner wires, water-based coolant, different wafer surfaces, new demands on texturing and on recycling of silicon kerf.