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<rss version="2.0"><channel><title>Kerf &amp; Korn</title><link>https://sic-processing.com/</link><description>Unabhängige Fachtexte zu Drahtsägen, Slurry, Siliciumcarbid und Recycling in der Waferfertigung</description><item><title>Critical raw materials and silicon: what the EU Critical Raw Materials Act means for wafers and chips</title><link>https://sic-processing.com/en/critical-raw-materials-silicon/</link><guid>https://sic-processing.com/en/critical-raw-materials-silicon/</guid><pubDate>2026-10-24</pubDate><description>Why silicon metal, gallium and germanium are strategic raw materials in the EU, what benchmarks and permitting rules the Critical Raw Materials Act sets, and how recycling of production scrap fits in.</description></item><item><title>Land and buildings for a wafer or chip plant: cleanrooms, ultrapure water, grid connection and zoning</title><link>https://sic-processing.com/en/fab-site-requirements/</link><guid>https://sic-processing.com/en/fab-site-requirements/</guid><pubDate>2026-10-24</pubDate><description>What a site must provide for a semiconductor fab or a solar wafer and cell plant: cleanroom classes under ISO 14644-1, ultrapure water, power supply and grid connection, hazardous substances, and the EU rules on environmental assessment, industrial emissions and major-accident hazards.</description></item><item><title>Recycling solar modules and wafer-production waste in the EU: WEEE rules and the circular economy</title><link>https://sic-processing.com/en/pv-module-recycling-weee/</link><guid>https://sic-processing.com/en/pv-module-recycling-weee/</guid><pubDate>2026-10-24</pubDate><description>How the WEEE Directive covers photovoltaic panels, which recovery targets apply, what changed in 2024, how modules are dismantled, and where circularity sits in wafer and semiconductor production.</description></item><item><title>Glossar: Drahtsägen, Slurry und Siliciumcarbid von A bis Z</title><link>https://sic-processing.com/glossar/</link><guid>https://sic-processing.com/glossar/</guid><pubDate>2026-10-24</pubDate><description>Die wichtigsten Fachbegriffe rund um Waferschneiden, Sägeslurry, Aufbereitung und Siliciumcarbid kurz erklärt, mit Verweisen auf die ausführlichen Artikel.</description></item><item><title>Sicherheit, Abfallrecht und REACH rund um Sägeslurry und Siliciumcarbid</title><link>https://sic-processing.com/sicherheit-umwelt-reach/</link><guid>https://sic-processing.com/sicherheit-umwelt-reach/</guid><pubDate>2026-10-24</pubDate><description>Welche Gefahren beim Umgang mit Sägeschlamm, SiC-Staub und Siliciumfeinstoffen bestehen (Wasserstoff, Staub, Fasern) und wie Abfallrahmenrichtlinie, Kreislaufwirtschaftsgesetz, REACH und CLP die Aufbereitung einordnen.</description></item><item><title>Industrial electricity prices in the EU: how they are measured and how to read them</title><link>https://sic-processing.com/en/industrial-electricity-prices-eu/</link><guid>https://sic-processing.com/en/industrial-electricity-prices-eu/</guid><pubDate>2026-10-23</pubDate><description>How Eurostat measures electricity prices for non-household consumers, what the consumption bands and price levels mean, why wholesale and retail prices differ, and what that implies for energy-intensive wafer, solar and SiC production.</description></item><item><title>Kerf loss and the recovery of silicon from sawing waste</title><link>https://sic-processing.com/en/kerf-loss-silicon-recovery/</link><guid>https://sic-processing.com/en/kerf-loss-silicon-recovery/</guid><pubDate>2026-10-23</pubDate><description>How much silicon is lost as kerf during wafering, why it is so hard to recover from slurry, what diamond wire changed, which contaminants matter and which recovery routes research describes.</description></item><item><title>From abrasive grit to semiconductor: silicon carbide in power electronics</title><link>https://sic-processing.com/en/silicon-carbide-power-electronics/</link><guid>https://sic-processing.com/en/silicon-carbide-power-electronics/</guid><pubDate>2026-10-23</pubDate><description>Why 4H-SiC suits power semiconductors: breakdown field, thermal conductivity, doping and native oxide, the weak spot at the MOS interface, and why sawing SiC crystals is a challenge of its own.</description></item><item><title>Sägeverlust (Kerf) und die Rückgewinnung von Silicium</title><link>https://sic-processing.com/kerfverlust-silicium-rueckgewinnung/</link><guid>https://sic-processing.com/kerfverlust-silicium-rueckgewinnung/</guid><pubDate>2026-10-23</pubDate><description>Wie viel Silicium beim Waferschneiden als Schnittfuge verloren geht, warum es so schwer zurückzugewinnen ist, welche Verunreinigungen stören und welche Wege Forschung und Patente beschreiben.</description></item><item><title>Körnung von SiC-Schleifmitteln: FEPA F, ISO 8486 und JIS verständlich erklärt</title><link>https://sic-processing.com/koernung-fepa-jis/</link><guid>https://sic-processing.com/koernung-fepa-jis/</guid><pubDate>2026-10-23</pubDate><description>Was Körnungsbezeichnungen wie F400, F800 oder GC#1000 bedeuten, wie Makro- und Mikrokörnungen gemessen werden, welche Medianwerte FEPA 42-2 festlegt und worauf man beim Vergleich von Normen achten muss.</description></item><item><title>Vom Schleifkorn zum Halbleiter: Siliciumcarbid in der Leistungselektronik</title><link>https://sic-processing.com/siliciumcarbid-leistungselektronik/</link><guid>https://sic-processing.com/siliciumcarbid-leistungselektronik/</guid><pubDate>2026-10-23</pubDate><description>Warum 4H-SiC für Leistungshalbleiter interessant ist: Durchbruchfeldstärke, Wärmeleitfähigkeit, Dotierung, MOS-Grenzfläche. Und warum das Sägen von SiC-Kristallen eine eigene Herausforderung ist.</description></item><item><title>Umstieg auf Diamantdraht: was sich beim Waferschneiden geändert hat</title><link>https://sic-processing.com/diamantdraht/</link><guid>https://sic-processing.com/diamantdraht/</guid><pubDate>2026-10-22</pubDate><description>Diamantdrahtsägen im Vergleich zum Slurry-Verfahren: gebundene Körnung, dünnere Drähte, wasserbasierte Kühlflüssigkeit, andere Waferoberflächen, neue Anforderungen an Texturierung und Recycling.</description></item><item><title>The switch to diamond wire: what changed in wafer cutting</title><link>https://sic-processing.com/en/diamond-wire-sawing/</link><guid>https://sic-processing.com/en/diamond-wire-sawing/</guid><pubDate>2026-10-22</pubDate><description>Diamond wire sawing compared with slurry sawing: fixed abrasive, thinner wires, water-based coolant, different wafer surfaces, new demands on texturing and on recycling of silicon kerf.</description></item><item><title>Silicon carbide: the material, the Acheson process and its uses</title><link>https://sic-processing.com/en/silicon-carbide-acheson/</link><guid>https://sic-processing.com/en/silicon-carbide-acheson/</guid><pubDate>2026-10-22</pubDate><description>What silicon carbide is, how it forms from quartz sand and coke in the Acheson furnace, why there is green and black SiC, how grit is made from it, where it is used and what occupational health rules apply.</description></item><item><title>Siting wafer, solar and chip plants in Europe: the Net-Zero Industry Act, the Chips Act and the practical criteria</title><link>https://sic-processing.com/en/siting-wafer-and-module-plants-in-europe/</link><guid>https://sic-processing.com/en/siting-wafer-and-module-plants-in-europe/</guid><pubDate>2026-10-22</pubDate><description>What the Net-Zero Industry Act and the European Chips Act actually offer a new wafer, cell, module or chip plant, how they differ, and which practical site criteria decide where such a plant can be built.</description></item><item><title>Vom Carborundum zum Diamantdraht: eine kurze Technikgeschichte des Waferschneidens und des Slurry-Recyclings</title><link>https://sic-processing.com/index.php/firmengeschichte.html</link><guid>https://sic-processing.com/index.php/firmengeschichte.html</guid><pubDate>2026-10-22</pubDate><description>Die technische Entwicklung in Etappen: Acheson und das Siliciumcarbid, das Mehrdrahtsägen mit loser Körnung, die Aufbereitung von SiC-Glykol-Slurries, der Wechsel zum Diamantdraht und die Rückgewinnung von Silicium.</description></item><item><title>Siliciumcarbid: Werkstoff, Acheson-Verfahren und Anwendungen</title><link>https://sic-processing.com/siliciumcarbid-acheson/</link><guid>https://sic-processing.com/siliciumcarbid-acheson/</guid><pubDate>2026-10-22</pubDate><description>Was Siliciumcarbid ist, wie es im Acheson-Ofen aus Quarzsand und Koks entsteht, warum es grünes und schwarzes SiC gibt, wie daraus Körnungen werden und wo der Werkstoff eingesetzt wird.</description></item><item><title>Aufbereitung und Rückgewinnung: wie SiC und Glykol aus Sägeslurry getrennt werden</title><link>https://sic-processing.com/index.php/Aufbereitung_und_Rückgewinnung.html</link><guid>https://sic-processing.com/index.php/Aufbereitung_und_Rückgewinnung.html</guid><pubDate>2026-10-21</pubDate><description>Die Verfahrensschritte der Slurry-Aufbereitung im Überblick: Fest-flüssig-Trennung, Zentrifugen und Hydrozyklone, Klassierung der SiC-Körnung, Entfernung von Silicium und Eisen, Rückgewinnung des Glykols.</description></item><item><title>Slurry reprocessing: how silicon carbide and glycol are recovered</title><link>https://sic-processing.com/en/slurry-recovery-process/</link><guid>https://sic-processing.com/en/slurry-recovery-process/</guid><pubDate>2026-10-21</pubDate><description>The unit operations of wire-saw slurry recovery: solid-liquid separation, hydrocyclones and centrifuges, grit classification, removal of silicon and iron, and recovery of the glycol.</description></item><item><title>Why spent sawing slurry is recycled</title><link>https://sic-processing.com/en/why-recycle-slurry/</link><guid>https://sic-processing.com/en/why-recycle-slurry/</guid><pubDate>2026-10-21</pubDate><description>What a spent wire-saw slurry contains, why silicon carbide and glycol are reused, how cost, EU waste law and resource value drive reprocessing, and where the limits are.</description></item></channel></rss>
